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TDA3661
Very low dropout voltage/quiescent current adjustable voltage regulator
Rev. 05 -- 28 June 2005 Product data sheet
1. General description
The TDA3661 is an adjustable voltage regulator with very low dropout voltage and quiescent current, which operates over a wide supply voltage range.
2. Features
s s s s s Output adjustable from 1.5 V to VP, 100 mA regulator Supply voltage range up to 45 V Very low quiescent current of 15 A (typical value) Very low dropout voltage Protections: x Reverse polarity safe (down to -25 V without high reverse current) x Negative transient of 50 V (RS = 10 , t < 100 ms) x Able to withstand voltages up to 18 V at the output (supply line may be short-circuited) x ESD protection on all pins x DC short-circuit safe to ground and VP of the regulator output x Temperature protection (at Tj > 150 C)
3. Quick reference data
Table 1: Quick reference data Tamb = 25 C; unless otherwise specified. Symbol Supply VP Iq supply voltage quiescent supply current output voltage regulator on VP = 14.4 V; IREG = 0 mA 3 14.4 15 45 30 V A Parameter Conditions Min Typ Max Unit
Regulator; k = 4.01929 [1] VREG 8 V VP 22 V; IREG = 0.5 mA 6 V VP 45 V; IREG = 0.5 mA 0.5 mA IREG 100 mA Vref VREG(drop)
VREG = Vref x k
4.8 4.75 4.75 1.181 -
5.0 5.0 5.0 1.244 0.18
5.2 5.25 5.25 1.306 0.3
V V V V V
reference voltage dropout voltage
VP = 14.4 V VP = 4.5 V; IREG = 50 mA; Tamb 85 C
[1]
Philips Semiconductors
TDA3661
Very low dropout voltage/quiescent current voltage regulator
4. Ordering information
Table 2: Ordering information Package Name TDA3661AT SO8 Description plastic small outline package; 8 leads; body width 3.9 mm Version SOT96-1 Type number
5. Block diagram
VP
8 REGULATOR BAND GAP THERMAL PROTECTION 2, 3, 6, 7
mgs579
1 5
REG ADJ
TDA3661
GND
Fig 1. Block diagram
6. Pinning information
6.1 Pinning
REG GND GND n.c.
1 2
8 7
VP GND GND ADJ
TDA3661
3 4
001aac940
6 5
Fig 2. Pin configuration
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TDA3661
Very low dropout voltage/quiescent current voltage regulator
6.2 Pin description
Table 3: Symbol REG GND n.c. ADJ VP
[1]
Pin description Pin 1 2, 3, 6 and 7 4 5 8 Description regulator output ground [1] not connected feedback input supply voltage
All GND pins are connected to the lead frame and can also be used to reduce the total thermal resistance Rth(j-a) by soldering these pins to a ground plane. The ground plane on the top side of the printed-circuit board acts like a heat spreader.
7. Functional description
The TDA3661 is an adjustable voltage regulator with an output voltage that can be fixed by means of an external resistor divider. The regulator can deliver output currents up to 100 mA. The regulator is available in an SO8 package. The regulator is intended for portable, mains and telephone applications. To increase the lifetime of batteries, a specially built-in clamp circuit keeps the quiescent current of this regulator very low, in dropout and full load conditions. The device remains operational down to very low supply voltages (typical 2 V) and below this voltage it switches off. A temperature protection is included which switches off the regulator output at a junction temperature above 150 C.
8. Limiting values
Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VP VP(rp) Ptot Parameter supply voltage reverse polarity supply voltage total power dissipation non-operating temperature of copper area is 25 C non-operating operating operating Conditions Min Max 45 -25 4.1 Unit V V W
Tstg Tamb Tj
storage temperature ambient temperature junction temperature
-55 -40 -40
+150 +125 +150
C C C
9. Thermal characteristics
Table 5: Symbol Rth(j-c) Rth(j-a)
9397 750 15049
Thermal characteristics Parameter thermal resistance from junction to case thermal resistance from junction to ambient Conditions to center pins; soldered in free air; soldered Typ 30 155 Unit K/W K/W
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Product data sheet
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Philips Semiconductors
TDA3661
Very low dropout voltage/quiescent current voltage regulator
10. Characteristics
Table 6: Characteristics VP = 14.4 V; Tamb = 25 C; k = 4.01929 [1]; measured with test circuit of Figure 15; unless otherwise specified. Symbol VP Iq Parameter supply voltage quiescent supply current Conditions regulator operating VP = 4.5 V; IREG = 0 mA VP = 14.4 V; IREG = 0 mA 6 V VP 24 V; IREG = 10 mA 6 V VP 24 V; IREG = 50 mA Regulator output: pin REG VREG output voltage 8 V VP 22 V; IREG = 0.5 mA 0.5 mA IREG 100 mA 6 V VP 45 V; IREG = 0.5 mA VREG(drop) VREG(stab) VREG(adj) VREG(line) VREG(load) SVRR Vref IREG(crl) ILO(rp) dropout voltage output voltage long-term stability output voltage adjustment range line input regulation voltage 7 V VP 22 V; IREG = 0.5 mA 7 V VP 45 V; IREG = 0.5 mA load output regulation voltage supply voltage ripple rejection reference voltage output current limit output leakage current at reverse polarity 0.5 mA IREG 50 mA fi = 120 Hz; Vi(ripple) = 1 V (RMS); IREG = 0.5 mA VP = 14.4 V VREG > 4 V VP = -15 V; VREG = 0.3 V VP = 4.5 V; Tamb 85 C; IREG = 50 mA per 1000 h 4.8 4.75 4.75 1.5 50 1.181 0.17 5.0 5.0 5.0 0.18 20 1 1 10 60 1.244 0.3 1 R1 + R2 R2 5.2 5.25 5.25 0.3 VP 30 50 50 1.306 500 V V V V mV V mV mV mV dB V A A
[2]
Min 3 -
Typ 14.4 10 15 0.2 1.4
Max 45 30 30 0.5 2.5
Unit V A A mA mA
Supply voltage: pin VP
[1] [2]
The output voltage can be calculated using the following formula: V REG = V ref x k where k = ------------------- and R1 + R2 100 k The regulator output will follow VP if VP < VREG + VREG(drop)
11. Application information
11.1 Noise
The output noise is determined by the value of the output capacitor. The noise figure is measured at a bandwidth of 10 Hz to 100 kHz; see Table 7.
Table 7: Noise figures Noise figure (V) C2 = 10 F 550 650 C2 = 47 F 320 400 C2 = 100 F 300 400
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Output current IREG (mA) 0.5 50
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TDA3661
Very low dropout voltage/quiescent current voltage regulator
11.2 Stability
The regulator is stabilized with an external capacitor connected to the output. For stable operation: 1. The output capacitor ESR should not exceed 22 (worst case) 2. A maximum ESR may be required; see Table 8 3. It is recommended not to use below 1 mA output current because of reduced phase margin 4. Use electrolytic capacitors for output capacitor values of 1 F and above.
Table 8: IREG (mA) 1 5 10 100 Minimum ESR values required C2 = 100 nF >0 >0 >0 >0 C2 = 1 F > 1.5 >0 >0 >0 C2 = 10 F >0 >0 >0 >0 C2 = 100 F >0 >0 >0 >0
11.3 Application circuits
The maximum output current of the regulator equals:
150 - T amb 150 - T amb I REG ( max ) = ---------------------------------------------------------- = ----------------------------------- ( mA ) 100 x ( V P - 5 ) R th ( j - a ) x ( V P - V REG )
When Tamb = 21 C, VP = 14 V and VREG = 5 V (k = 4.01929) the maximum output current equals 140 mA. For successful operation of the IC (maximum output current capability) special attention has to be given to the copper area required as heatsink (connected to all GND pins), the thermal capacity of the heatsink and its ability to transfer heat to the external environment. It is possible to reduce the total thermal resistance from 155 K/W to 50 K/W.
11.3.1 Application circuit with backup function
Sometimes, a backup function is needed to supply, for example, a microcontroller for a short period of time when the supply voltage spikes to 0 V (or even -1 V). This function can easily be built with the TDA3661 by using an output capacitor with a large value. When the supply voltage is 0 V (or -1 V), only a small current will flow into pin REG from this output capacitor (a few A). The application circuit is given in Figure 3.
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Product data sheet
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TDA3661
Very low dropout voltage/quiescent current voltage regulator
VP
8 C1(1) 1 F
1 R1 75.1 k C2 (2)
VREG =5V
TDA3661
5 2, 3, 6, 7
R2 24.9 k
mgs582
(1) C1 is optional (to minimize supply noise only) (2) C2 4700 F
Fig 3. Application circuit with backup function
11.3.2 Application circuit with enable function
An enable function can easily be built with the TDA3661 by connecting a diode to pin ADJ. When the voltage on pin ADJ is forced above 1.3 V, the output will switch off. The standby current is equal to the quiescent current of the TDA3661. The application circuit is given in Figure 4.
VP
8 C1(1) 1 F
1 R1 75.1 k D1 R2 24.9 k
mgs583
TDA3661
5 2, 3, 6, 7
C2 10 F
VREG =5V
enable
C1 is optional (to minimize supply noise only)
Fig 4. Application circuit with enable function
11.4 Additional application information
This section gives typical curves for various parameters measured on the TDA3661AT. Standard test conditions are: VP = 14.4 V, Tamb = 25 C and k = 4.01929.
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Product data sheet
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TDA3661
Very low dropout voltage/quiescent current voltage regulator
25 Iq (A) 20
mda947
4 Iq (mA) 3
mda949
15
2 10
5
1
0 0 10 20 VP (V) 30 0 0 10 20 30 40 VP (V) 50
IREG = 0 mA.
Fig 5. Quiescent current as a function of the supply voltage
Fig 6. Quiescent current increase as a function of high supply voltage
2 Iq (mA) 1.5
(1)
mda951
0.48 Iq (mA)
mda948
0.44
1
0.40 0.5
(2)
0 -40
0
40
80
120
160 Tj (C)
0.36 5 10 15 20 VP (V) 25
(1) Iq at 50 mA load. (2) Iq at 10 mA load.
IREG = 10 mA.
Fig 7. Quiescent current as a function of the junction temperature
Fig 8. Quiescent current as a function of the supply voltage
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Product data sheet
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TDA3661
Very low dropout voltage/quiescent current voltage regulator
2 Iq (mA)
mda950
4 Iq (mA) 3
mda952
1.8
2 1.6 1
1.4 5 10 15 20 VP (V) 25 0 0 20 40 60 80 100 IREG (mA)
IREG = 50 mA.
Fig 9. Quiescent current as a function of the supply voltage
Fig 10. Quiescent current as a function of the output current
6 VREG (V)
mda955
500
VREG(drop) (mV) 400
mda957
4
300
2 200
0 -50
100 0 50 100 150 Tj (C) 200 0 40 80 IREG (mA) 120
IREG = 0 mA.
IREG = 0 mA.
Fig 11. Output voltage thermal protection as a function of the junction temperature
Fig 12. Dropout voltage as a function of the output current
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Product data sheet
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TDA3661
Very low dropout voltage/quiescent current voltage regulator
6 VREG (V) 4
mda954
-30 SVRR (dB) -40
mda956
(1)
(2)
-50
(3)
2 -60
(1)
(2)
0 0 100 200 IREG (mA) 300
-70 10
(3)
102
103
104
f (Hz)
105
VP = 8 V and pulsed load
IREG = 10 mA; C2 = 10 F. (1) SVRR at RL = 100 . (2) SVRR at RL = 500 . (3) SVRR at RL = 10 k.
Fig 13. Fold back protection mode
Fig 14. Supply voltage ripple rejection as a function of the ripple frequency
12. Test information
12.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
12.2 Test circuit
VREG R1 75.1 k C2 = 5 V 10 F
VP
8 C1(1) 1 F
1
TDA3661
5 2, 3, 6, 7
R2 24.9 k
mgs581
C1 is optional (to minimize supply noise only)
Fig 15. Test circuit
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Product data sheet
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TDA3661
Very low dropout voltage/quiescent current voltage regulator
13. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 JEITA EUROPEAN PROJECTION A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.041 0.228 0.016 0.024
8o o 0
ISSUE DATE 99-12-27 03-02-18
Fig 16. Package outline SOT96-1 (SO8)
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TDA3661
Very low dropout voltage/quiescent current voltage regulator
14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 C to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:
* below 225 C (SnPb process) or below 245 C (Pb-free process)
- for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages.
* below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
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TDA3661
Very low dropout voltage/quiescent current voltage regulator
- smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C.
14.5 Package related soldering information
Table 9: Package [1] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC [5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L [8], PMFP [9], WQCCN..L [8]
[1] [2]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable [4] Reflow [2] suitable suitable
suitable not not recommended [5] [6] recommended [7]
suitable suitable suitable not suitable
not suitable
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
[3]
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Product data sheet
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TDA3661
Very low dropout voltage/quiescent current voltage regulator
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[5] [6] [7] [8]
[9]
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Product data sheet
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TDA3661
Very low dropout voltage/quiescent current voltage regulator
15. Revision history
Table 10: Revision history Release date 20050628 Data sheet status Product data sheet Change notice Doc. number 9397 750 15049 Supersedes TDA3661_4 Document ID TDA3661_5 Modifications:
* * *
The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. Paragraph removed from Section 7 Figure 3, Figure 4 and Figure 13 removed from the previous version Product specification Preliminary specification Preliminary specification Preliminary specification 9397 750 07864 9397 750 07554 9397 750 06797 9397 750 06067 TDA3661_3 TDA3661_2 TDA3661_1 -
TDA3661_4 TDA3661_3 TDA3661_2 TDA3661_1
20001213 20001208 20000201 19990920
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Very low dropout voltage/quiescent current voltage regulator
16. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
19. Trademarks
Notice -- All referenced brands, product names, service names and trademarks are the property of their respective owners.
18. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
20. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
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Very low dropout voltage/quiescent current voltage regulator
21. Contents
1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 11.1 11.2 11.3 11.3.1 11.3.2 11.4 12 12.1 12.2 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 4 Noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Stability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application circuits . . . . . . . . . . . . . . . . . . . . . . 5 Application circuit with backup function . . . . . . 5 Application circuit with enable function . . . . . . . 6 Additional application information . . . . . . . . . . . 6 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 11 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 12 Package related soldering information . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information . . . . . . . . . . . . . . . . . . . . 15
(c) Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 28 June 2005 Document number: 9397 750 15049
Published in The Netherlands

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